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- These machines meet the needs of the ultrahigh accuracy and micro-miniature machining fields that require micrometer and nanometer level machining technologies as a result of the trends toward smaller and lighter parts with higher functionality. They can handle workpieces of 200 x 200 x 60 mm in size, making them ideal for machining the progressive dies of semiconductor devices, precision dies and precision plastic molds.
- Various types of wires can be threaded with high reliability, ranging from an ultrafine wire diameter of 0.02 mm to a diameter of 0.2 mm. (The 0.02 mm wire diameter specification is available only on the UPJ-2.)
- Featuring Makino's compact, built-in AWC3 with high reliability and capable of holding workpieces accurately to within ±1.0 μm. (option)
- A core removal unit automatically removes various sizes of cores, from ultra-small to large, as well as irregularly shaped cores.
- Full machine covers and comprehensive temperature control mechanisms effectively minimize thermal distortion induced by shop temperature changes.
- A cubic machine design achieves a space-saving footprint.
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